April 8, 2013

Sara Lynn McCall, Graduate Assistant

Camp Invention to be Held June 3 - 7

VALDOSTA – Valdosta State University will host its second weeklong Camp Invention from 9 a.m. – 3:30 p.m. on Monday – Friday, June 3 – 7, in Nevins Hall.  Camp Invention is a weeklong summer day program for rising first through 6th graders, which was created in partnership with the National Inventors Hall of Fame and the United States Patent and Trademark Office.

The program engages children to discover their own innate creativity and inventiveness through hands-on Science, Technology, Engineering and Math (STEM) content. This will be a week of hands-on science fun and creative problem solving led by qualified educators. 

This year’s Camp Invention program is GEO-Quest, which features the I Can Invent: Launchitude module, where children combine physics and re-engineered household items to create the ultimate Duck Chucking Device.

“Last year we had 71 attendees, and we had a wonderful time,” said Dr. Denise Reid, program director. “I am really looking forward to this year. We have a new curriculum this year. The students will be involved in active learning and have lots of fun.”

Each day children rotate through integrated modules that employ creative thinking to solve real-world challenges. Children learn vital 21st century life skills such as problem solving and teamwork through imaginative play. Even if a child has participated in Camp Invention in the past, he or she will benefit from brand new adventures throughout the week.

The regular cost is $220 or $215 for registering online.  There are multi-child discounts, and VSU employees get a rate of $195. You will need to register online to receive the discount and must use your school e-mail address.  The discount code for VSU employees is CHDS.    

To learn more about the camp or to enroll, visit www.campinvention.org or call 800.968.4332. For more information, contact Reid at dtreid@valdosta.edu or 229-333-5784 or visithttp://ww2.valdosta.edu/mathcs/CampInvention.shtml.